Team Group Memory modules

 
 
  • 2 DDR3
  • the volume of module 8 GB
  • form factor : DIMM 240-pin
  • the 2600 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 11
 
 
 
  • 2 DDR3
  • the volume of module 4 GB
  • form factor : DIMM 240-pin
  • the 2600 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 11
 
 
 
  • 2 DDR3
  • the volume of module 8 GB
  • form factor : DIMM 240-pin
  • the 2133 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 11
 
 
 
  • 2 DDR3
  • the volume of module 4 GB
  • form factor : DIMM 240-pin
  • the 2133 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 11
 
 
 
  • 2 DDR3
  • the volume of module 8 GB
  • form factor : DIMM 240-pin
  • frequency 1600 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 9
 
 
 
  • 2 DDR3
  • the volume of module 4 GB
  • form factor : DIMM 240-pin
  • frequency 1600 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 9
 
 
 
  • 1 DDR3 memory module
  • the volume of module 2 GB
  • form factor : DIMM 240-pin
  • the 1333 MHz
  • CAS Latency (CL): 9
 
 
 
  • 1 DDR3 memory module
  • the volume of module 4 GB
  • form factor : DIMM 240-pin
  • the 1333 MHz
  • CAS Latency (CL): 9
 
 
 
  • 1 DDR3 memory module
  • the volume of module 4 GB
  • form factor SODIMM, 204-pin
  • the 1333 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 9
 
 
 
  • 1 DDR3 memory module
  • the volume of module 2 GB
  • form factor SODIMM, 204-pin
  • the 1333 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 9
 
 
 
  • 2 DDR memory module
  • the volume of module 1 GB
  • form factor DIMM 184-pin
  • the frequency of 500 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 3
 
 
 
  • 2 of the DDR3
  • the volume of module 1 GB
  • form factor DIMM 240-pin
  • frequency 1600 MHz
  • radiator for additional cooling
  • CAS Latency (CL): 7
 
 
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